The agreement, through the next decade, spans the Qualcomm Snapdragon Digital Chassis portfolio, including Cockpit and Ride platforms, the latter of which helped to powers the BMW iX3 to the top five-star rating in the first Euro NCAP test since introduction of new, more stringent assessment standard.
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As AI infrastructure scales rapidly, memory chip manufacturers are redirecting advanced capacity toward the high‑bandwidth memory used in data centers, so the auto industry is scrambling to ensure the supply of memory and storage chips from industry leaders like Micron.
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The chip company’s BQ79826Z-Q1 features the industry’s first support for up to 26 cells per device, delivering best-in-class sensing accuracy and reduced system costs, and its smart EIS engine enables early warning of thermal runaway in electric vehicles and energy storage systems.
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Native color, which the company says is the next step in the evolution of lidar technology, is available with its new Rev8 technology powered by its next-generation L4 silicon, providing up to double the range and resolution for better functional safety, reliability, affordability, and scale.
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The A²B 2.0 delivers a 4x bandwidth increase and up to a 30% system cost reduction, its advanced feature set enabling more immersive audio experiences across all vehicle classes and advanced features such as acoustic alerting, E-Call, DSP amplification, road-noise cancellation, and personal sound zones.
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Its Stellar P3E MCU enables real-time AI applications at the edge to significantly enhance vehicle intelligence, simplify multi-function integration for X-in-1 ECUs, and deliver real-time performance for applications from xEV efficiency to body zonal architectures.
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At CES 2026, the AI powerhouse released an open-reasoning VLA Alpamayo family of open AI models designed to tackle long-tail AV challenges, announced an expanded Drive Hyperion ecosystem, and said the ADAS in the Mercedes-Benz CLA signals the broader rollout of its full-stack software across the industry.
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The S32N7 automotive processor series is said to transform vehicles into intelligent edge devices by centralizing software and data across all vehicle domains, solving complexity, and unlocking AI-powered vehicle capabilities.
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Helping automakers bring higher levels of autonomy to their entire fleet are a scalable high-performance compute SoC, a single-chip, eight-by-eight 4D imaging radar transceiver, and a new Ethernet networking physical layer device.
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At its inaugural Autonomy & AI Day in Palo Alto, the company outlined, and we cover here in depth, its roadmap for next-generation vehicle autonomy, introduced an evolved software architecture underpinned by artificial intelligence, and unveiled proprietary silicon to support the efforts.
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