Volkswagen Group and Qualcomm Technologies, Inc. today announced a LOI (Letter of Intent) for a long-term supply agreement to deliver advanced infotainment and connectivity capabilities powered by Snapdragon Digital Chassis solutions. The news was previewed with the media during CES 2026, for which Qualcomm hosted Futurride.

The intent is for Qualcomm to serve as Volkswagen Group’s primary technology provider for the launch of its zonal SDV architecture developed for the Western hemisphere through Volkswagen Group’s joint venture with Rivian Automotive called RV Tech (Rivian and Volkswagen Group Technologies).

The software-defined joint venture was launched in June 2024, with Volkswagen Group announcing it would invest an initial $1 billion in Rivian, with up to $4 billion in planned additional investment for a total expected deal size of $5 billion, to build on Rivian’s industry-leading software and electrical architecture to create a best-in-class SDV technology platform. (see Futurride’s coverage here.) RV Tech is co-led by Rivian’s Chief Software Officer, Wassym Bensaid, and VW’s Chief Technology Officer, Carsten Helbing, with VW Group CEO Oliver Blume overseeing the strategic partnership for Volkswagen.

Qualcomm will provide high-performance SoCs (system-on-chips) for infotainment capabilities starting in 2027. The company also has a collaboration with VW Group’s ADA (Automated Driving Alliance), formed by VW automotive software unit CARIAD and Bosch, to accelerate highly automated driving development.

“Next-gen infotainment solutions and driver assistance systems are becoming increasingly important for differentiating our products and now account for a significantly higher share of vehicle value,” said Karsten Schnake, Member of the Board of Management for Procurement at the Volkswagen Passenger Cars brand and Member of the Extended Volkswagen Group Executive Committee. “With Qualcomm Technologies as one partner for the future, we are securing long-term access to the semiconductors that are essential for these technologies.”

The new agreement reinforces Volkswagen’s strategy to consolidate procurement of key components and expand expertise in integrating semiconductors and AI (artificial intelligence) technologies, ensuring scalable, future-ready mobility solutions across its vehicle portfolio.

“High-performance semiconductors are the foundation for the next generation of connected vehicles,” said Werner Tietz, Member of the Board of Management for Research and Development at SEAT S.A. and Head of Volkswagen Group Research and Development. “They enable us to seamlessly align software and hardware. With access to these advanced chips, we aim to accelerate the development of powerful and scalable technologies to deliver a digital driving experience that continuously evolves for our customers at competitive costs.”

Rivian and Volkswagen Group Technologies aims to leverage the Snapdragon Cockpit Platform for immersive digital experiences based on the zonal SDV architecture, for which high-performance modular central computers manage all vehicle functions. Customers can benefit from advanced infotainment and highly automated driving functions, updated over-the-air to keep vehicles current and enhance the driving experience.

“We are proud to deepen our longstanding collaboration with Volkswagen Group and serve as a trusted partner for its future vehicle platforms,” said Nakul Duggal, EVP and Group GM, Automotive, Industrial, and Embedded IoT and Robotics, Qualcomm Technologies, Inc. “The Snapdragon Digital Chassis provides the foundation for software-defined architectures, enabling next-generation infotainment and advanced driver assistance systems that emphasize safety, performance, and scalability.”

Volkswagen Group will integrate the SDV architecture in the Western hemisphere into the ID.EVERY1 and all future electric vehicles built on the SSP (Scalable Systems Platform). The Group aims to offer the “technologically state-of-the-art” products across different segments, price classes, and international markets.

At a “works meeting” in early 2025, VW brand CEO Thomas Schäfer said that a goal is to build the next-generation electric Golf on the new SSP platform in Wolfsburg, along with the high-volume electric T-Roc. The SSP will represent the next generation of an all-electric, fully digitalized, highly scalable mechatronics platform based on a uniform system architecture.

“Volkswagen Group is advancing toward a fully software-defined future, and we are proud that Snapdragon Digital Chassis will serve as a core enabler of that transformation,” said Enrico Salvatori, SVP and President, Qualcomm Europe, Qualcomm Europe, Inc. “Together, we are advancing a modern vehicle architecture that is software-defined, AI-ready, and globally scalable—supporting updatable infotainment and accelerating the development of highly automated driving.”

Vehicles that use the Snapdragon Cockpit Platform can help deliver agentic AI-driven experiences that anticipate needs, adapt in real time, and provide proactive assistance, from personalized climate and seating adjustments to optimized routes and multimodal voice or gesture controls.

The Automated Driving Alliance aims to leverage Snapdragon Ride Elite, Qualcomm’s most powerful automotive compute platform, to advance the development of automated driving. The goal is an AI-based system scalable across brands and model lines and fully compatible with the SDV.

Powered by an end-to-end AI architecture, Snapdragon Ride Elite delivers ultra-low latency for sensor processing and real-time decision-making.

The intended supply agreement is currently being driven forward by Audi AG and Volkswagen Passenger Cars with the goal of achieving a Group-wide impact. Group brands also intend to integrate Snapdragon 5G Modem RF and V2X technology into next-generation SDV-based vehicles, enabling ultra-fast connectivity and real-time communication for safer, smarter, and more connected driving.